Segmented showerhead for uniform delivery of multiple precursors

ABSTRACT

Apparatus for supplying vaporized reactants to a reaction chamber are described herein. In some embodiments, a showerhead assembly for depositing multiple materials on a substrate includes a plurality of gas delivery portions, each gas delivery portion having an inlet, a wedge shaped body that defines a plenum, and a plurality of openings disposed on a bottom surface of the gas delivery portion, wherein each of the plenums are fluidly isolated from each other.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims benefit of U.S. provisional patent applicationSer. No. 62/731,1799, filed Sep. 14, 2018, which is herein incorporatedby reference in its entirety.

FIELD

Embodiments of the present disclosure generally relate to substrateprocessing equipment and techniques, and more particularly, to anapparatus for supplying gases to a reaction chamber.

BACKGROUND

Organic vapor deposition is becoming increasingly relevant in buildingsemiconductor devices such as complementary metal oxide semiconductor(CMOS) image sensors (CIS) and other optical devices. However, theinventors have observed that depositing organic material on a workpiecein a deposition process is problematic due to purity and/orcontamination concerns that, among other things, prevent the use of acarrier gas.

Often, there is a need to deposit more than one material at a time.However, in some applications, the inventors have observed thatco-depositing a cooler material with a warmer material can cause thecooler material to dissociate and cause the warmer material to condense.

Accordingly, the inventors have provided an improved apparatus fordepositing multiple materials onto a substrate.

SUMMARY

Embodiments of apparatus for supplying multiple process gases, such asvaporized reactants, to a reaction chamber are described herein. In someembodiments, a showerhead assembly for depositing multiple materials ona substrate includes a plurality of gas delivery portions, each gasdelivery portion having an inlet, a wedge shaped body that defines aplenum, and a plurality of openings disposed on a bottom surface of thegas delivery portion, wherein each of the plenums are fluidly isolatedfrom each other.

In some embodiments, a showerhead assembly includes a first gas deliveryportion defining a first plenum, a second gas delivery portion defininga second plenum, a third gas delivery portion defining a third plenum,and a fourth gas delivery portion defining a fourth plenum, wherein eachof the first, second, third, and fourth gas delivery portions include aninlet and a plurality of openings, and wherein each of the first,second, third, and fourth plenums are fluidly isolated from each other.

In some embodiments, a method of introducing precursors through asegmented showerhead having a plurality of gas delivery portions thatare fluidly isolated includes heating a first gas delivery portion to afirst temperature; and simultaneously heating a second gas deliveryportion to a second temperature different than the first temperature,wherein each of the first and second gas delivery portions (i) have awedge shaped body that defines a plenum, (ii) are coplanar, and (iii)together form a showerhead having a circular shape.

Other and further embodiments of the present disclosure are describedbelow.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present disclosure, briefly summarized above anddiscussed in greater detail below, can be understood by reference to theillustrative embodiments of the disclosure depicted in the appendeddrawings. The appended drawings illustrate some embodiments of thedisclosure and are therefore not to be considered limiting of scope, forthe disclosure may admit to other equally effective embodiments.

FIG. 1 shows a schematic side view of a deposition system having ashowerhead assembly in accordance with some embodiments of the presentdisclosure.

FIG. 2 shows a top isometric view of a showerhead and lid assembly inaccordance with some embodiments of the present disclosure.

FIG. 3 shows a top isometric cross-sectional view of a showerhead andlid assembly in accordance with some embodiments of the presentdisclosure.

FIG. 4 shows a top isometric view of a gas delivery portion of ashowerhead in accordance with some embodiments of the presentdisclosure.

FIG. 5 shows a partial sectional view of a gas delivery portion of ashowerhead in accordance with some embodiments of the presentdisclosure.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. The figures are not drawn to scale and may be simplifiedfor clarity. Elements and features of one embodiment may be beneficiallyincorporated in other embodiments without further recitation.

DETAILED DESCRIPTION

Embodiments of apparatus for processing a substrate and/or providingmultiple process materials to a deposition chamber are provided herein.The apparatus of the present disclosure includes a showerhead assemblyand/or delivery system configured to advantageously prevent thermalcross-talk between two or more adjacent process materials before exitingthe delivery system. For example, two or more species or samples ofprocess material may be individually processed through the apparatus inthermal isolation, or relative thermal isolation, at the same ordifferent temperatures prior to exiting a showerhead assembly anddepositing on a substrate. The apparatus of the present disclosureadvantageously reduces a pressure drop across a showerhead assembly.Although the process may be described in terms of organic thin filmsdeposited, grown, or condensed on a substrate or workpiece, the processof the present disclosure may be applied to any substrate process thatrequires delivery of multiple process materials, and in particular, insuch processes where the multiple process materials are beneficiallyisolated from each other in accordance with the teachings providedherein.

FIG. 1 shows a schematic side view of a deposition system 100 inaccordance with some embodiments of the present disclosure. Thedeposition system 100 includes a deposition chamber 110 defined, atleast in part, by one or more sides 111, a floor 128, and a lid 130. Thedeposition system 100 is configured to process a substrate, such assubstrate 116, in the deposition chamber 110. The substrate is supportedby a substrate support 114 disposed in the deposition chamber 110. Insome embodiments, the deposition chamber 110 may be a CVD chamberconfigured to perform process material deposition such as organicprecursor deposition in accordance with the present disclosure. Onenon-limiting system suitable for use or that can be adapted for use inaccordance with the present disclosure is the ENDURA® line of processingsystems available from Applied Materials, Inc. of Santa Clara, Calif.Other processing systems, including those available from othermanufacturers, can also be modified in accordance with the teachingsprovided herein. In some embodiments, the apparatus in accordance withthe present disclosure may be utilized in a chamber configured toperform atomic layer deposition (ALD).

In some embodiments, an organic layer (not shown), or derivativesthereof may be formed, condensed, or deposited by a deposition processon substrate 116. In some embodiments, the layer may be formed ofmultiple process materials that would otherwise undesirably react witheach other within a conventional showerhead. In some embodiments, thelayer may be formed of multiple process materials that have differenceprocess requirements, such as flow rate, temperature, or the like. Insome embodiments, suitable process materials for use in the apparatus ofthe present disclosure include any material suitable for sublimation andcondensation on a substrate, for example tris (8-hydroxyquinolinato)aluminum (Alq3) or buckminsterfullerene (C₆₀). Other process gases mayalso suitably be used, in particular but not limited to, process gasesthat require one or more of different flow rates, differenttemperatures, or different gas distribution systems to prevent reactionsbetween the respective process gases within the gas distribution system.

The deposition system 100 includes the deposition chamber 110 and aprecursor delivery system 120. In some embodiments, the precursordelivery system 120 may include one or more heating systems 142 (twoshown in FIG. 1 ). In some embodiments, the precursor delivery system120 may include one or more gas delivery systems 150 (two shown in FIG.1 ). In some embodiments, the components of the deposition system 100are connected and in communication such that processing material in theone or more heating systems 142 may be sublimated and subsequentlypassed through gas delivery system 150 into deposition chamber 110. Insome embodiments, the one or more heating systems 142, the gas deliverysystem 150, and the deposition chamber 110 may be in fluidcommunication.

The precursor delivery system 120 is configured to deliver the multipleprocess materials to a showerhead assembly 112 and substrate 116 influid communication with the showerhead assembly 112. The showerheadassembly 112 includes a plurality of gas delivery portions. In someembodiments, the plurality of gas delivery portions are coplanar andtogether form a showerhead assembly 112 having a circular shape. Theplurality of gas delivery portions are fluidly isolated from each other(e.g., material in each gas delivery portion cannot intermix with orcontact the materials in other gas delivery portions within theshowerhead assembly 112). The precursor delivery system 120 is capableof delivering a first process material to one or more of the gasdelivery portions at a first temperature. In some embodiments, the firsttemperature is about 200 degrees to about 350 degrees Celsius. Theprecursor delivery system 120 is capable of delivering a second processmaterial to one or more of the gas delivery portions at a secondtemperature different than the first temperature. In some embodiments,the second temperature is about 450 degrees to about 600 degreesCelsius. In some embodiments, the precursor delivery system 120 iscapable of delivering a third process material to one or more of the gasdelivery portions at the first temperature, the second temperature, or athird temperature different than the first temperature and the secondtemperature. In some embodiments, the precursor delivery system 120 iscapable of delivering a fourth process material to one or more of thegas delivery portions at the first temperature, the second temperature,the third temperature, or a fourth temperature different than the firsttemperature, the second temperature, and the third temperature. In use,the substrate support 114 is capable of rotating the substrate 116 suchthat process materials from the plurality of gas delivery portions areuniformly deposited onto the substrate 116.

In addition to the fluid isolation provided between the plurality of gasdelivery portions, in some embodiments, the plurality of gas deliverysections are further configured to reduce or prevent thermal cross-talkbetween each gas delivery section prior to exiting into the depositionchamber 110, as described in further detail below. For example, thetemperature of the first process material will not affect, or will havea lessened effect on, the temperature of the second process materialwithin the showerhead assembly 112. In some embodiments, a temperaturedifference between the first process material and the second processmaterial is between about 200 to about 400 degrees Celsius. In someembodiments, the showerhead assembly 112 is configured to deliverprocess material to the deposition chamber 110 without condensing theone or more process material(s) therein.

In some embodiments, the deposition system 100 may include componentsused to execute and monitor pre-determined processes (e.g., depositingfilms) in the deposition system 100. Such components generally includevarious sub-systems (e.g., vacuum and exhaust sub-systems, and the like)and devices (e.g., power supplies, process control instruments, and thelike) of the deposition system 100. In some embodiments, the depositionsystem 100 includes a first pump 180, a second pump 181, a throttlevalve 184, and a pressure valve 183 to control the pressure of thesystem and bring or maintain the deposition system 100 at vacuumconditions. The pressure valve 183 may be included to remove vacuumconditions.

FIG. 2 shows a top isometric view of a showerhead and lid assembly inaccordance with some embodiments of the present disclosure. As shown,the showerhead and lid assembly 200 comprises a plurality of gasdelivery portions including a first gas delivery portion 220, a secondgas delivery portion 230, a third gas delivery portion 240, and a fourthgas delivery portion 250. The plurality of gas delivery portions 220,230, 240, 250 are coplanar and together form a showerhead assembly 112having a circular shape. In some embodiments, the showerhead diameter isabout 300 mm to about 500 mm. In some embodiments, the showerheaddiameter corresponds with a diameter of the substrate 116. In someembodiments, the plurality of gas delivery portion can include three gasdelivery portions. In some embodiments, the plurality of gas deliveryportions can include six gas delivery portions. The plurality of gasdelivery portions 220, 230, 240, 250 are arranged such that there is agap 246 between each gas delivery portion. The spaced relation betweenthe gas delivery portions 220, 230, 240, 250 advantageously reduces orprevents thermal cross-talk between each gas delivery portion prior toexiting into the deposition chamber 110.

Referring back to FIG. 1 , a first heating assembly 125 is configured toapply heat to the first gas delivery portion 220. The first heatingassembly 125 may comprise one or more heating elements configured tomaintain the first gas delivery portion at a substantially uniformtemperature. In some embodiments, the first heating assembly 125includes a heating element, such as a resistive heater, in at least oneof the top wall and the bottom wall of the first gas delivery portion220 (discussed below). The first heating assembly 125 is configured toapply heat to a first process material passing through the first gasdelivery portion 220 at a predetermined temperature, such as the firsttemperature, as the first process material moves into the depositionchamber 110.

In some embodiments, a one or more first temperature sensor 141 and afirst temperature controller 124 are coupled to the first gas deliveryportion 220. The one or more first temperature sensor 141 is configuredto obtain thermal information from the first gas delivery portion 220.The first temperature controller 124 is configured to receive input fromthe one or more first temperature sensor 141 to control, adjust, or seta temperature of the first heating assembly 125. The first temperaturesensor 141 can be a thermocouple, a pyrometer, or the like.

A second heating assembly 127 is configured to apply heat to the secondgas delivery portion 230. The second heating assembly 127 may compriseone or more heating elements configured to maintain the second gasdelivery portion 230 at a substantially uniform temperature. In someembodiments, the first heating assembly 125 includes a heating element,such as a resistive heater, in at least one of the top wall and thebottom wall of the second gas delivery portion 230. The second heatingassembly 127 is configured to apply heat to a second process materialpassing through the second gas delivery portion 230 at a predeterminedtemperature, such as the second temperature, as the second processmaterial moves into the deposition chamber 110.

In some embodiments, a one or more second temperature sensor 143 and asecond temperature controller 126 are coupled to the second gas deliveryportion 230. The one or more second temperature sensor 143 is configuredto obtain thermal information from the second gas delivery portion 230.The second temperature controller 126 is configured to receive inputfrom the one or more second temperature sensor 143 to control, adjust,or set a temperature of the second heating assembly 127. The one or moresecond temperature sensor 143 can be a thermocouple, a pyrometer, or thelike.

A third heating assembly 155 is configured to apply heat to the thirdgas delivery portion 240. The third heating assembly 155 may compriseone or more heating elements configured to maintain the third gasdelivery portion 240 at a substantially uniform temperature. In someembodiments, the third heating assembly 155 includes a heating element,such as a resistive heater, in at least one of the top wall and thebottom wall of the third gas delivery portion 240. The third heatingassembly 155 is configured to apply heat to a process material passingthrough the third gas delivery portion 240 at a predeterminedtemperature, such as the first temperature, the second temperature, or athird temperature, as the process material moves into the depositionchamber 110. The process material may be the first process material, thesecond process material, or a third process material. In someembodiments, a temperature difference between the first temperature andthe second temperature is between about 200 to about 400 degreesCelsius.

In some embodiments, a one or more third temperature sensor and a thirdtemperature controller 163 are coupled to the third gas delivery portion240. The one or more third temperature sensor 145 is configured toobtain thermal information from the third gas delivery portion 240. Thethird temperature controller 163 is configured to receive input from theone or more third temperature sensor 145 to control, adjust, or set atemperature of the third heating assembly 155. The one or more thirdtemperature sensor 145 can be a thermocouple, a pyrometer, or the like.

A fourth heating assembly 159 is configured to apply heat to the fourthgas delivery portion 250. The fourth heating assembly 159 may compriseone or more heating elements configured to maintain the fourth gasdelivery portion 250 at a substantially uniform temperature. In someembodiments, the fourth heating assembly 159 includes a heating element,such as a resistive heater, in at least one of the top wall and thebottom wall of the fourth gas delivery portion 250. The fourth heatingassembly 159 is configured to apply heat to a process material passingthrough the fourth gas delivery portion 250 at a predeterminedtemperature, such as the first temperature, the second temperature, thethird temperature, or a fourth temperature, as the process materialmoves into the deposition chamber 110. The process material may be thefirst process material, the second process material, the third processmaterial, or a fourth process material.

In some embodiments, a one or more fourth temperature sensor 147 and afourth temperature controller 165 are coupled to the fourth gas deliveryportion 250. The one or more fourth temperature sensor 147 is configuredto obtain thermal information from the fourth gas delivery portion 250.The fourth temperature controller 165 is configured to receive inputfrom the one or more fourth temperature sensor 147 to control, adjust,or set a temperature of the fourth heating assembly 159. The one or morefourth temperature sensor 147 can be a thermocouple, a pyrometer, or thelike.

Referring back to FIG. 2 , the showerhead and lid assembly 200 includesa showerhead assembly 112 mounted to a lid plate 210. The lid plate 210has a plurality of mounts 204 extending from a bottom surface 202 of thelid plate 210. Each of the gas delivery portions 220, 230, 240, 250 ofthe showerhead assembly 112 include one or more mounts 216 that arecapable of mating with corresponding mounts 204 of the lid plate 210 tocouple the showerhead assembly 201 to the lid plate 210. In someembodiments, the one or more mounts 216 extend from a radially outersurface of the showerhead assembly 112. In some embodiments, the mounts204, 216 are made of an insulative material.

In some embodiments, as shown in FIG. 2 , the plurality of gas deliveryportions 220, 230, 240, 250 are similar in size. In some embodiments,the plurality of gas delivery portions may be different sizes. In someembodiments, the showerhead assembly 112 is capable of flowing twoprocess gases. For example, the first gas delivery portion 220 and thethird gas delivery portion 240 are coupled to a first gas source and thesecond gas delivery portion 230 and the fourth gas delivery portion 250are coupled to a second gas source. In some embodiments, the showerheadassembly 112 is capable of flowing three process gases. For example, thefirst and third gas delivery portions 220, 240 coupled to a first gassource, the second gas delivery portion 230 coupled to a second gassource, and the fourth gas delivery portion 250 coupled to a third gassource. In some embodiments, the showerhead assembly 112 is capable offlowing four process gases.

The first gas delivery portion 220 includes a wedge shaped body thatdefines a first plenum 318. The first gas delivery portion 220 includesa first inlet 208 extending from the wedge shaped body and through anopening in the lid plate 210. Similarly, the second gas delivery portion230, the third gas delivery portion 240, and the fourth gas deliveryportion 250 include a second inlet 212, a third inlet 214, and a fourthinlet 224, extending from their respective wedge shaped bodies throughan opening in the lid plate 210. In some embodiments, each inlet 208,212, 214, 224 is disposed adjacent a respective outer portion of eachgas delivery portion 220, 230, 240, 250.

The first gas delivery portion 220 includes a plurality of openings 226extending from a bottom surface 236 of the wedge shaped body to thefirst plenum 318. The plurality of openings 226 are configured todeliver a process gas into the deposition chamber 110. The gas deliveryportions 230, 240, 250 include a plurality of openings 228, 232, 234,respectively, extending from their respective bottom surfaces 238, 242,244. The plurality of openings 228, 232, 234 are configured to deliver aprocess gas from each of the gas delivery portions 230, 240, 250 intothe deposition chamber 110. The plurality of openings 226, 228, 232, 243may be arranged in any pattern suitable for uniformly depositing processmaterials onto the substrate 116. In some embodiments, the plurality ofopenings 226, 228, 232, 243 have a diameter of about 0.1 mm to about 3mm.

The showerhead and lid assembly 200 includes a plurality of feedthroughplates 218. The plurality of feedthrough plates 218 are configured toallow wires to pass from the showerhead assembly 112 through the lidplate 210. The wires can be heater wires, sensor wires, or the like. Insome embodiments, the each of the plurality of feedthrough plates 218include a plurality of openings 222. In some embodiments, a feedthroughplate 218 is disposed next to each of the plurality of gas deliveryportions 220, 230, 240, 250. In some embodiments, one or more heaterwires 206 (one shown) are configured to pass through one of thefeedthrough plates 218 and into the first gas delivery portion 220.

FIG. 3 shows a top isometric cross-sectional view of a showerhead andlid assembly in accordance with some embodiments of the presentdisclosure. The lid plate 210 has a top surface 302 opposite the bottomsurface 202. In some embodiments, the lid plate 210 includes channels310 extending from the top surface 302 towards the bottom surface 202.The channels 310 are configured to flow fluid to cool the lid plate 210.In some embodiments, the channels 310 may be partially filled with plugs308 to seal the channels 310. In some embodiments, the top surface 302includes a first port 304 and a second port 306. The first port 304 andthe second port 306 are configured to flow fluid into and out of thechannels 310. The fluid can be coolant, water, or the like.

The first gas delivery portion 220 includes a top wall 332, a bottomwall 334, and sidewalls 336 to define a first plenum 318. Similarly, topwalls, bottom walls, and sidewalls of the second, third, and fourth gasdelivery portions 230, 240, 250 define a second plenum (inner volume of230), a third plenum 320, and a fourth plenum (inner volume of 250),respectively. As discussed above, the showerhead assembly 112 may becoupled to the lid plate via the one or more mounts 216 that extend froma radially outer surface of the showerhead assembly 112. The gasdelivery portions 220, 230, 240, 250 of the showerhead assembly 112 maybe coupled to each other at a central portion of the showerhead assembly112 with a plug 324 while maintaining the gap 246 therebetween. The plug324 may have a central opening 326 that is capable of receiving a maleportion of a fastener.

In some embodiments, a heat sink 330 is disposed in the gap 246 betweenadjacent gas delivery portions. In some embodiments, the heat sink 330,has a conductivity of about 150 W/m-K or greater. The heat sink 330 isconfigured to reduce or prevent heat from a gas delivery portion 220,230, 240, 250 from radiating to the gas delivery portion 220, 230, 240,250 that is cooler (i.e., thermal cross-talk). In some embodiments, theheat sink 330 comprises a thermally anisotropic material. A thermallyanisotropic material is a material that advantageously has an in-planethermal conductivity (conductivity in the basal plane) much greater thana transverse thermal conductivity of the material, thus allowing forincreased temperature uniformity in the direction of the plane. ThermalPyrolytic Graphite® (TPG) is an example of a thermally anisotropicmaterial having an in-plane thermal conductivity of about 1,500 W/m-Kand a transverse thermal conductivity of about 10 W/m-K. Other examplesof suitable anisotropic materials include pyrolytic boron nitride,synthetic diamonds, or the like.

As shown in FIGS. 2 and 3 , the plurality of gas delivery portions 220,230, 240, 250 are similar (i.e., identical). The following discussionwill be with respect to the first gas delivery portion 220. However, thesame discussion is applicable to the second, third, and fourth gasdelivery portions 230, 240, 250. In some embodiments, the top wall 332of the first gas delivery portion 220 includes channels capable ofcarrying wires 312 of a resistive heater. In some embodiments, thebottom wall 334 of the first gas delivery portion 220 includes channels314 capable of carrying wires of a resistive heater. In someembodiments, the first gas delivery portion 220 includes wires 312 inthe top wall 332 and wires (e.g. wire 506) disposed in the channels 314in the bottom wall 334 to advantageously heat the first gas deliveryportion 220 uniformly. In some embodiments, the first inlet 208 iscapable of being heated by the first heating assembly 125. In someembodiments, a post 322 is disposed through the top wall 332 and atleast partially through the bottom wall 334. The post 322 is configuredto facilitate measuring a temperature of a bottom end of the post 322disposed in the bottom wall 334 to provide a temperature measurement ofthe bottom wall 334. In some embodiments, a post 328 is disposed atleast partially through the top wall 332. The post 328 is configured tofacilitate measuring a temperature of a bottom end of the post 328disposed in the top wall 332 to provide a temperature measurement of thetop wall 322. For example, in some embodiments, the post 322 and thepost 328 are tubes with an upper portion having a central opening and abottom portion that is solid. The central openings of the post 322 andthe post 328 are configured to accommodate respective thermocouples. Insome embodiments, at least one of the post 322 and the post 328 arecoupled to the one or more first temperature sensors 141.

FIG. 4 shows a top isometric view of a gas delivery portion inaccordance with some embodiments of the present disclosure. In someembodiments, the first gas delivery portion 220 includes a wedge shapedbody 408 and a curved portion 410 that curves radially outwards from anouter surface 412 of the wedge shaped body 408. The first inlet 208 maybe disposed adjacent the curved portion 410.

In some embodiments, the first gas delivery portion 220 includes a heatshield 402 that substantially covers (i.e., envelopes) the wedge shapedbody 408. The heat shield 402 includes a plurality of openings thatcorrespond with the plurality of openings 226 of the first gas deliveryportion 220. In some embodiments, the heat shield 402 includes anopening 406 for post 328. In some embodiments, the heat shield 402includes an opening 414 for post 322. In some embodiments, the heatshield 402 includes one or more openings 404 for one or more mounts 216.The heat shield 402 is configured to reduce or prevent heat fromradiating from the first gas delivery portion 220 to adjacent gasdelivery portions (i.e., thermal cross-talk). The heat shield 402 isformed of stainless steel, aluminum, or the like. The wedge shaped body408 is formed of a high purity and high thermal resistance material,such as stainless steel, titanium, or the like.

FIG. 5 shows a partial sectional view of a gas delivery portion inaccordance with some embodiments of the present disclosure. As shown inFIG. 5 , a nozzle 316 may be placed in each hole of the plurality ofopenings 226. In some embodiments, the nozzle 316 can have an innerdiameter of about 0.1 mm to about 3 mm. In some embodiments, the nozzle316 comprises titanium, titanium alloy, or titanium nitride coatedsteel. The nozzle 316 can be configured to control speed, direction, andflow of process material. The nozzle 316 is configured to spray processmaterial passing from the first plenum 318 into the deposition chamber110. Spraying of the process material can advantageously increases theuniformity of deposition of the process material onto the substrate 116.Spraying of the process material also advantageously increases theuniformity of mixing of the multiple process materials onto thesubstrate 116. In some embodiments, wires 506 (only one shown) aredisposed in the channels 314 in the bottom wall 334 to heat the firstgas delivery portion 220.

While the foregoing is directed to embodiments of the presentdisclosure, other and further embodiments of the disclosure may bedevised without departing from the basic scope thereof.

The invention claimed is:
 1. A showerhead assembly for depositingmultiple materials on a substrate, comprising: a plurality of gasdelivery portions, each gas delivery portion having an inlet, a wedgeshaped body comprising a curved outer wall and two sidewalls that extendfrom opposite ends of the curved outer wall to a common joint, whereinthe wedge shaped body defines a plenum, and a plurality of openingsdisposed on a bottom surface of the gas delivery portion, wherein eachof the plenums are fluidly isolated from each other.
 2. The showerheadassembly of claim 1, wherein the plurality of gas delivery portionsconsist of a first gas delivery portion, a second gas delivery portion,a third gas delivery portion, and a fourth gas delivery portion thattogether form a showerhead having a circular shape.
 3. The showerheadassembly of claim 2, wherein the first gas delivery portion and thethird gas delivery portion are coupled to a first gas source and thesecond gas delivery portion and the fourth gas delivery portion arecoupled to a second gas source.
 4. The showerhead assembly of claim 2,further comprising a first heating assembly configured to provide heatto the first gas delivery portion, a second heating assembly configuredto provide heat to the second gas delivery portion, a third heatingassembly configured to provide heat to the third gas delivery portion,and a fourth heating assembly configured to provide heat to the fourthgas delivery portion.
 5. The showerhead assembly of claim 4, wherein thefirst heating assembly includes a resistive heater in at least one of atop wall and a bottom wall of the gas delivery portion.
 6. Theshowerhead assembly of claim 1, wherein the plurality of gas deliveryportions are similar in size and together form a showerhead having acircular shape.
 7. The showerhead assembly of claim 1, furthercomprising a heat sink having a conductivity of about 150 W/m-K orgreater disposed between the plurality of gas delivery portions.
 8. Theshowerhead assembly of claim 1, wherein each gas delivery portionincludes one or more mounts that extend outward from a radially outersurface of each gas delivery portion.
 9. The showerhead assembly ofclaim 1, further comprising a nozzle disposed in the plurality ofopenings.
 10. The showerhead assembly of claim 1, wherein each inlet isdisposed radially outward of the plurality of openings disposed on thebottom surface of each respective gas delivery portion.
 11. A showerheadassembly, comprising: a first gas delivery portion defining a firstplenum; a second gas delivery portion defining a second plenum; a thirdgas delivery portion defining a third plenum; and a fourth gas deliveryportion defining a fourth plenum, wherein each of the first, second,third, and fourth gas delivery portions include an inlet and a pluralityof openings, wherein each of the first, second, third, and fourth gasdelivery portions are wedge shaped having curved outer walls, whereinthe curved outer walls define an outer wall of the showerhead assembly,and wherein each of the first, second, third, and fourth plenums arefluidly isolated from each other.
 12. The showerhead assembly of claim11, further comprising a shield that envelops each gas delivery portion.13. The showerhead assembly of claim 11, wherein the first gas deliveryportion, the second gas delivery portion, the third gas deliveryportion, and the fourth gas delivery portion are coplanar and togetherform a showerhead having a circular shape.
 14. The showerhead assemblyof claim 11, wherein one or more mounts for mounting to a lid plateextend radially outward from an outer surface of each of the first gasdelivery portion, second gas delivery portion, third gas deliveryportion, and the fourth gas delivery portion.
 15. The showerheadassembly of claim 11, wherein a heat sink having a conductivity of about150 W/m-K or greater is disposed in a gap between adjacent gas deliveryportions.
 16. The showerhead assembly of claim 11, wherein the first gasdelivery portion includes a top wall and a bottom wall, and wherein apost is disposed through the top wall and at least partially through thebottom wall and configured to facilitate measuring a temperature of thebottom wall.